HTSC (06886) has announced the conclusion of the issuance process for its 2026 second tranche of technology innovation corporate bonds, which were offered to professional investors. The bond issuance officially ended on September 17, 2026.
The final scale of this bond tranche reached 1 billion yuan, with a coupon rate set at 1.55%. The issuance attracted robust demand, achieving a subscription multiple of 4.34 times, underscoring strong market confidence in the company's credit profile.
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